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TN1205T-600B-TR - STMicroelectronics

Description: STMicroelectronics, TN1205T-600B-TR, Thyristor, 600V 8A, 5mA 3+Tab-Pin, DPAK

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TN1205T-600B-TR - STMicroelectronics PCB footprint - Other - Other - DPAK_2022_Master
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TN1205T-600B-TR Details

  • Manufacturer Part Number:

    TN1205T-600B-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252

  • Package Description:

    ROHS COMPLIANT, PLASTIC, DPAK-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.48

  • Case Connection:

    ANODE

  • Circuit Commutated Turn-off Time-Nom:

    55 µs

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    100 V/us

  • DC Gate Trigger Current-Max:

    5 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    15 mA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    120 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • On-state Current-Max:

    12000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    12 A

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    SCR

TN1205T-600B-TR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, avoid overheating, and follow the recommended operating temperature range (TJ) of -40°C to 150°C. Also, consider derating the device's power handling at higher temperatures.
  • The TN1205T-600B-TR has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and storage. For latch-up prevention, ensure proper power sequencing and decoupling capacitors are used.
  • While the TN1205T-600B-TR is a high-performance device, it's essential to consult with STMicroelectronics or a qualified representative to determine its suitability for high-reliability or aerospace applications, as additional testing and certification may be required.
  • Follow the recommended soldering profile and assembly guidelines provided in the STMicroelectronics application note AN5275. Ensure proper soldering techniques, and avoid overheating or excessive mechanical stress during assembly.

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TN1205T-600B-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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