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TN1215-600G-TR - STMicroelectronics

Description: SCR 600 V 12 A Standard Recovery Surface Mount D2PAK , 15 mA , -40°C ~ 125°C , D2PAK

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TN1215-600G-TR - STMicroelectronics PCB footprint - Other - Other - D2PAK_2026
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TN1215-600G-TR - STMicroelectronics  - 3D model - Other - D2PAK_2026
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TN1215-600G-TR Details

  • Manufacturer Part Number:

    TN1215-600G-TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK

  • Package Description:

    D2PAK-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.48

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    200 V/us

  • DC Gate Trigger Current-Max:

    0.2 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    30 mA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    146 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • On-state Current-Max:

    8000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    12 A

  • Repetitive Peak Off-state Leakage Current-Max:

    5 µA

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    SCR

TN1215-600G-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TN1215-600G-TR should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat efficiently. Avoid routing critical signals under the device to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, follow the recommended derating curves for the TN1215-600G-TR. Implement adequate heat sinking, and consider using thermal interface materials to reduce thermal resistance. Monitor the device's junction temperature and adjust the system design accordingly.
  • For EMI and EMC compliance, ensure proper PCB layout, decoupling, and filtering. Use a common-mode choke or ferrite bead to reduce emissions. Implement a shielded enclosure, and consider using EMI-absorbing materials. Follow the recommended layout and component placement guidelines to minimize radiation.
  • To troubleshoot and debug issues with the TN1215-600G-TR, use a systematic approach. Verify the power supply, check for proper pin connections, and ensure correct component values. Use oscilloscopes or logic analyzers to monitor signals and identify anomalies. Consult the datasheet and application notes for guidance on specific troubleshooting techniques.
  • Handle the TN1215-600G-TR with care to prevent damage. Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress. Follow the recommended storage and handling procedures outlined in the datasheet and industry standards.

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TN1215-600G-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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