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TN2010H-6G - STMicroelectronics

Description: High temperature 20 A SCRs

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TN2010H-6G - STMicroelectronics PCB footprint - Other - Other - TN2010H-6G-1
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TN2010H-6G Details

  • Manufacturer Part Number:

    TN2010H-6G

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    D2PAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.48

  • Case Connection:

    ANODE

  • Circuit Commutated Turn-off Time-Nom:

    70 µs

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    400 V/us

  • DC Gate Trigger Current-Max:

    10 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    40 mA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    197 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • On-state Current-Max:

    12700 A

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • RMS On-state Current-Max:

    20 A

  • Repetitive Peak Off-state Leakage Current-Max:

    3900 µA

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    SCR

TN2010H-6G Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4392, which includes guidelines for thermal pad connection, copper thickness, and via placement to ensure optimal thermal performance.
  • The input capacitor selection depends on the input voltage, current, and frequency. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the maximum input voltage, and a capacitance value between 1uF to 10uF. Consult the application note AN4392 for more detailed guidance.
  • The maximum allowed voltage drop across the internal resistance (Rds(on)) is typically around 1.5V to 2V, depending on the operating conditions and temperature. Exceeding this limit may lead to reduced performance, increased power dissipation, or even device failure.
  • Yes, the TN2010H-6G is suitable for high-frequency switching applications up to 1MHz. However, it's essential to consider the device's switching losses, parasitic inductance, and capacitance to ensure reliable operation. Consult the application note AN4392 for guidance on high-frequency design considerations.
  • Proper cooling is crucial for the TN2010H-6G. Ensure good thermal contact between the device and the heat sink, and consider using thermal interface materials (TIMs) to reduce thermal resistance. The application note AN4392 provides guidelines for thermal design and heat sink selection.

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TN2010H-6G Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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