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TN4015H-6I - STMicroelectronics

Description: High junction temperature: Tj = 150 °C  High noise immunity dV/dt = 500 V/µs up to 150 °C  Gate triggering current IGT = 15 mA  Peak off-sate voltage 600 V VDRM/VRRM  High turn on current rise dI/dt = 100 A/µs

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TN4015H-6I - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - . TO-220AB insulated package mechanical data-
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TN4015H-6I - STMicroelectronics  - 3D model - Transistor Outline, Vertical - . TO-220AB insulated package mechanical data-
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TN4015H-6I Details

  • Manufacturer Part Number:

    TN4015H-6I

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer Package Code:

    TO-220AB Ins

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Case Connection:

    ISOLATED

  • Circuit Commutated Turn-off Time-Nom:

    85 µs

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    500 V/us

  • DC Gate Trigger Current-Max:

    15 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Leakage Current-Max:

    0.01 mA

  • Non-Repetitive Pk On-state Cur:

    394 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-State Voltage-Max:

    1.6 V

  • On-state Current-Max:

    25000 A

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • RMS On-state Current-Max:

    40 A

  • Reference Standard:

    UL CERTIFIED

  • Repetitive Peak Off-state Leakage Current-Max:

    6000 µA

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    SCR

TN4015H-6I Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the thermal pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal management, and consider using a heat sink if necessary. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially even device failure. It's crucial to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection during handling and assembly, it's essential to follow proper ESD handling procedures, such as using ESD-safe materials, grounding straps, and wrist straps. Additionally, consider using ESD protection devices or diodes to protect the device from electrostatic discharge.
  • To ensure the device remains in good condition, store it in a cool, dry place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or electrical connections. Use anti-static packaging and follow proper ESD handling procedures during storage and handling.

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TN4015H-6I Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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