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TN4015H-6T - STMicroelectronics

Description: 40 A 600 V 150 °C junction temperature SCR in TO-220AB package

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TN4015H-6T - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB-ren6
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TN4015H-6T - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-220AB-ren6
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TN4015H-6T Details

  • Manufacturer Part Number:

    TN4015H-6T

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer Package Code:

    TO-220AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2016-09-12

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • Case Connection:

    ANODE

  • Circuit Commutated Turn-off Time-Nom:

    85 µs

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    500 V/us

  • DC Gate Trigger Current-Max:

    15 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.01 mA

  • Non-Repetitive Pk On-state Cur:

    394 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-State Voltage-Max:

    1.6 V

  • On-state Current-Max:

    25000 A

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • RMS On-state Current-Max:

    40 A

  • Repetitive Peak Off-state Leakage Current-Max:

    6000 µA

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    SCR

TN4015H-6T Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the TN4015H-6T near a thermal pad or a heat sink, ensuring good thermal conductivity. A 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern around the device can help dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power dissipation according to the ambient temperature. Additionally, ensure that the PCB is designed to withstand the high temperatures.
  • The TN4015H-6T has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly. Ensure that the PCB design includes ESD protection diodes and that the device is handled in an ESD-controlled environment.
  • To troubleshoot issues with the TN4015H-6T, start by verifying the power supply voltage, checking for overheating, and ensuring that the device is properly soldered. Use oscilloscopes or logic analyzers to monitor the device's signals and identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • When using the TN4015H-6T in a high-reliability or safety-critical application, ensure that the device is properly derated, and the system is designed with redundant or fail-safe mechanisms. Follow industry standards and guidelines for safety-critical designs, and consider using additional safety features such as watchdog timers or redundant power supplies.

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TN4015H-6T Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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