TNPV12102M00BEEN footprint, schematic symbol and 3D model by Vishay

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TNPV12102M00BEEN Details

Manufacturer Part Number:
TNPV12102M00BEEN
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
CHIP
Reach Compliance Code:
Compliant
ECCN Code:
EAR99
HTS Code:
8533.21.00.30
Factory Lead Time:
14 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
14
Additional Feature:
ANTI-SULFUR; LASER TRIMMABLE; PRECISION; RATED AC VOLTAGE (V): 1000
Construction:
Rectangular
JESD-609 Code:
e3
Mounting Feature:
SURFACE MOUNT
Number of Terminals:
2
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Package Height:
0.6 mm
Package Length:
3.2 mm
Package Style:
SMT
Package Width:
2.45 mm
Packing Method:
TR, PAPER, 7 INCH
Rated Power Dissipation (P):
0.33 W
Rated Temperature:
70 °C
Reference Standard:
AEC-Q200
Resistance:
2000000 Ω
Resistor Type:
FIXED RESISTOR
Size Code:
1210
Surface Mount:
YES
Technology:
THIN FILM
Temperature Coefficient:
25 ppm/°C
Terminal Finish:
MATTE TIN OVER NICKEL
Terminal Shape:
WRAPAROUND
Tolerance:
0.1%
Working Voltage:
1000 V

Vishay provides a recommended PCB layout and land pattern in their application note AN10364, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal performance and to prevent thermal runaway.
The TIM should be applied according to Vishay's recommendations, typically a thin layer (around 0.05 mm) of thermal interface material with a thermal conductivity of at least 1 W/m-K. Improper TIM application can lead to reduced thermal performance and increased thermal resistance.
Vishay recommends derating the voltage by 10% to 20% to ensure reliable operation and to prevent electrical overstress. This means that if the maximum rated voltage is 12 V, the maximum allowed voltage should be around 10.8 V to 11.4 V.
Follow the recommended soldering and reflow profiles provided by Vishay, typically a peak temperature of 260°C to 270°C for a maximum of 10 seconds. Ensure the PCB is designed with a suitable solder mask and that the components are properly aligned during the reflow process.
Store the components in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the components by the body, avoiding touching the leads or electrical contacts to prevent electrostatic discharge (ESD) damage.

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