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TOMCT16031002BT1 - Vishay

Description: 10k Ohm ±0.1% 750mW Power Per Element Isolated 8 Resistor Network/Array ±25ppm/°C 16-SOIC (0.220", 5.59mm Width)

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PCB Footprints
TOMCT16031002BT1 - Vishay PCB footprint - Other - Other - SOIC-16 (TOMC)
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TOMCT16031002BT1 - Vishay  - 3D model - Other - SOIC-16 (TOMC)
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TOMCT16031002BT1 Details

  • Manufacturer Part Number:

    TOMCT16031002BT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.25

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.1 W

  • First Element Resistance:

    10000 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2.03 mm

  • Package Length:

    11.176 mm

  • Package Style:

    SMT

  • Package Width:

    5.59 mm

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    10000 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    10000 Ω

  • Size Code:

    4422

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    GULL WING

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

TOMCT16031002BT1 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it's recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can reduce thermal resistance.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and use a gentle touch to avoid damaging the device. Avoid using excessive solder or flux, as this can lead to shorts or contamination.
  • The maximum allowed voltage derating for the TOMCT16031002BT1 is typically 80% of the maximum rated voltage. This means that if the device is rated for 100V, the maximum allowed voltage derating would be 80V. However, it's always best to consult with the manufacturer or a qualified engineer for specific derating guidelines.
  • While the TOMCT16031002BT1 is primarily designed for low-frequency applications, it can be used in high-frequency applications with some caution. However, the device's parasitic capacitance and inductance may affect its performance at high frequencies. It's essential to evaluate the device's behavior through simulation or testing before using it in a high-frequency application.
  • The TOMCT16031002BT1 is a moisture-sensitive device, so it's essential to handle it in a dry environment. Store the devices in their original packaging or a dry, nitrogen-filled container. Avoid exposing the devices to humid environments, and follow the manufacturer's recommended baking procedures before soldering.

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TOMCT16031002BT1 Overview

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