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TP2262-SR - 3Peak Incorporated

Description: General Purpose Operational Amplifier, 2 Circuit, 8-SOP

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PCB Footprints
TP2262-SR - 3Peak Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC_2023
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3D Models
TP2262-SR - 3Peak Incorporated  - 3D model - Small Outline Packages - 8-Pin SOIC_2023
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TP2262-SR Details

  • Manufacturer Part Number:

    TP2262-SR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    3peak Incorporated

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Packing Method:

    TR, 13 INCH

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    6 V/us

  • Slew Rate-Nom:

    15 V/us

  • Supply Current-Max:

    2.4 mA

  • Supply Voltage Limit-Max:

    40 V

  • Supply Voltage-Nom (Vsup):

    30 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    177827.941

  • Wideband:

    NO

  • Width:

    3.9 mm

TP2262-SR Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider using a thermal interface material (TIM) between the device and the heat sink. Additionally, ensure that the device is not exposed to temperatures above the recommended maximum junction temperature (Tj) of 150°C.
  • The maximum allowed voltage on the EN (enable) pin is 6V. Exceeding this voltage may damage the device. It's recommended to use a voltage limiter or a voltage divider to ensure the EN pin voltage remains within the specified range.
  • Yes, the TP2262-SR can be used in switching regulator applications. However, it's essential to ensure that the device is operated within the recommended frequency range (100 kHz to 1 MHz) and that the output voltage is properly filtered to prevent high-frequency noise from affecting the device's operation.
  • To calculate the power dissipation of the device, use the following formula: Pd = (Vin - Vout) x Iout x Efficiency. Where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Efficiency is the device's efficiency (typically around 95% for the TP2262-SR).

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TP2262-SR Overview

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