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TP3B476K010C0600AS - Vishay

Description: Solid Tantalum Surface Mount Chip Capacitors TANTAMOUNT(TM) Molded Case, High Performance, Automotive Grade

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Symbol
TP3B476K010C0600AS - Vishay - PCB symbol
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PCB Footprints
TP3B476K010C0600AS - Vishay PCB footprint - Capacitor Moulded Polarised - Capacitor Moulded Polarised - Case Code B
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3D Models
TP3B476K010C0600AS - Vishay - 3D model - Capacitor Moulded Polarised - Case Code B
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TP3B476K010C0600AS Details

  • Manufacturer Part Number:

    TP3B476K010C0600AS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Israel, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    12

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ

  • Capacitance:

    47 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (DRY/SOLID)

  • ESR:

    600 mΩ

  • Height:

    1.9 mm

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.0047 mA

  • Length:

    3.5 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    10 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    152 mA

  • Size Code:

    1411

  • Surface Mount:

    YES

  • Tan Delta:

    0.06

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    J BEND

  • Width:

    2.8 mm

TP3B476K010C0600AS Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the TP3B476K010C0600AS is a rectangular pad with dimensions of 12.7 mm x 6.35 mm, with a thermal pad of 6.35 mm x 6.35 mm in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area for the thermal pad.
  • To ensure reliable thermal performance, ensure good thermal contact between the device and the heat sink or PCB. Apply a thin layer of thermal interface material (TIM) to the thermal pad, and use a heat sink with a thermal conductivity of at least 1 W/m-K. Also, ensure good airflow around the device and heat sink.
  • The maximum allowed voltage derating for the TP3B476K010C0600AS is 80% of the rated voltage. This means that if the device is rated for 1000 V, the maximum allowed voltage derating would be 800 V.
  • The TP3B476K010C0600AS is designed for low-frequency applications up to 100 kHz. While it may be possible to use it in high-frequency applications, the device's performance and reliability may be compromised. It's recommended to consult with Vishay Intertechnologies or a qualified engineer for high-frequency applications.
  • Handle the TP3B476K010C0600AS with care to prevent mechanical damage. Store the devices in their original packaging or in a protective container to prevent moisture and contamination. Avoid exposing the devices to extreme temperatures, humidity, or physical stress during storage and shipping.

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TP3B476K010C0600AS Overview

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