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TP3D475K050C1200AS - Vishay

Description: Solid Tantalum Surface Mount Chip Capacitors TANTAMOUNT(TM) Molded Case, High Performance, Automotive Grade

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TP3D475K050C1200AS - Vishay - PCB symbol
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PCB Footprints
TP3D475K050C1200AS - Vishay PCB footprint - Capacitor Moulded Polarised - Capacitor Moulded Polarised - Case Code D
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3D Models
TP3D475K050C1200AS - Vishay - 3D model - Capacitor Moulded Polarised - Case Code D
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TP3D475K050C1200AS Details

  • Manufacturer Part Number:

    TP3D475K050C1200AS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Israel, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ

  • Capacitance:

    4.7 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (DRY/SOLID)

  • ESR:

    1200 mΩ

  • Height:

    2.8 mm

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.0024 mA

  • Length:

    7.3 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    50 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    148 mA

  • Size Code:

    2917

  • Surface Mount:

    YES

  • Tan Delta:

    0.06

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    J BEND

  • Width:

    4.3 mm

TP3D475K050C1200AS Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the TP3D475K050C1200AS is a rectangular pad with dimensions of 12.7 mm x 7.62 mm (0.5 in x 0.3 in) with a thermal pad of 6.35 mm x 6.35 mm (0.25 in x 0.25 in) in the center.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C (482°F to 500°F) and a solder with a melting point of 217°C to 220°C (423°F to 428°F). Apply a small amount of solder paste to the PCB pads and use a reflow oven or a hot air gun to solder the component.
  • The maximum allowed voltage derating for the TP3D475K050C1200AS is 10% to 15% of the rated voltage, depending on the operating conditions and the desired reliability level. Consult the datasheet and application notes for more information.
  • The TP3D475K050C1200AS is designed for low-frequency applications up to 100 kHz. For high-frequency applications, consider using a different capacitor with a higher self-resonant frequency (SRF) and a lower equivalent series resistance (ESR).
  • Store the TP3D475K050C1200AS in a dry, cool place away from direct sunlight and moisture. Avoid bending, flexing, or applying mechanical stress to the component. Use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.

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TP3D475K050C1200AS Overview

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