EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY, UL RECOGNIZED
Breakdown Voltage-Max:
26.9 V
Breakdown Voltage-Min:
24 V
Case Connection:
ISOLATED
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
O-PALF-W2
Non-rep Peak Rev Power Dis-Max:
5000 W
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
ROUND
Package Style:
LONG FORM
Peak Reflow Temperature (Cel):
260
Polarity:
BIDIRECTIONAL
Power Dissipation-Max:
8 W
Reference Standard:
AEC-Q101; IEC-61000-4-2, 4-4
Rep Pk Reverse Voltage-Max:
22 V
Surface Mount:
NO
Technology:
AVALANCHE
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
WIRE
Terminal Position:
AXIAL
Time@Peak Reflow Temperature-Max (s):
30
TP5KP22CA Frequently Asked Questions (FAQs)
The recommended mounting pad layout for the TP5KP22CA is a rectangular pad with a minimum size of 0.05 inches x 0.05 inches, with a 0.02 inch radius corner. The pad should be centered on the device and have a solder mask defined around it to prevent solder bridging.
To ensure reliable soldering of the TP5KP22CA, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 180°C to 190°C. Apply a small amount of solder to the pad and component lead, and use a gentle touch to avoid applying excessive pressure or heat.
The maximum surge current rating of the TP5KP22CA is 5000A, with a pulse width of 10/1000μs. This rating is based on the device's ability to withstand a single surge event, and repeated surges may reduce the device's lifespan.
The TP5KP22CA is designed for low-frequency applications, and its performance may degrade at high frequencies. If you need to use the device in a high-frequency application, consult with Littelfuse Inc or a qualified engineer to determine its suitability and potential modifications.
The correct lead forming for the TP5KP22CA involves bending the leads to a 90-degree angle, with a minimum bend radius of 0.05 inches. The leads should be formed to ensure that they do not touch each other or the device body, and that they are securely soldered to the PCB.
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TP5KP22CA Overview
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