TPD7107F,BXH footprint, schematic symbol and 3D model by Toshiba

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TPD7107F,BXH Details

Toshiba recommends a thermal pad connection to a large copper area on the PCB to dissipate heat efficiently. Ensure a minimum of 1oz copper thickness and a thermal via array under the package to improve thermal conductivity.
Choose an input capacitor with a low ESR (Equivalent Series Resistance) and sufficient capacitance to filter the input voltage ripple. A 10uF to 22uF ceramic capacitor with an ESR of <1 ohm is recommended.
Select an output capacitor with a low ESR and sufficient capacitance to filter the output voltage ripple. A 10uF to 22uF ceramic capacitor with an ESR of <1 ohm is recommended. Ensure the capacitor's voltage rating is higher than the output voltage.
Follow the recommended power-up and power-down sequences in the datasheet. Ensure a slow and controlled voltage ramp-up and ramp-down to prevent latch-up or damage to the device.
Keep the input and output capacitors close to the device, with short traces and minimal loop areas to reduce EMI. Use a solid ground plane and keep sensitive signal traces away from the switching node.

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