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TPH1500CNH,L1Q - Toshiba

Description: Pb-F POWER MOSFET TRANSISTOR TSON-ADV MOQ=5000 PD=78W F=1MHZ

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TPH1500CNH,L1Q - Toshiba - PCB symbol
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PCB Footprints
TPH1500CNH,L1Q - Toshiba PCB footprint - Other - Other - SOP Advance-2021
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TPH1500CNH,L1Q - Toshiba - 3D model - Other - SOP Advance-2021
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TPH1500CNH,L1Q Details

  • Manufacturer Part Number:

    TPH1500CNH,L1Q

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.12

  • Avalanche Energy Rating (Eas):

    198 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    38 A

  • Drain-source On Resistance-Max:

    0.0154 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    50 pF

  • JESD-30 Code:

    S-PDSO-F8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    78 W

  • Pulsed Drain Current-Max (IDM):

    148 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TPH1500CNH,L1Q Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended for optimal thermal performance. The thermal pad should be connected to the ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power rating at high temperatures.
  • Handle the device by the body, not the leads. Avoid bending or twisting the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent ESD damage.
  • Choose input capacitors with low ESR and high ripple current ratings. Output capacitors should have low ESR and be rated for the output voltage and current. Consider using ceramic or film capacitors for their low ESR and high reliability.
  • Use a shielded enclosure and ensure good grounding practices. Keep the device and its associated components away from sensitive analog circuits. Use EMI filters or common-mode chokes to reduce emissions and susceptibility.

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TPH1500CNH,L1Q Overview

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