The recommended land pattern for the TPH2R104PL,LQ is a rectangular pad with a size of 2.5mm x 1.6mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
The TPH2R104PL,LQ has a thermal resistance of 2.5°C/W. To handle thermal considerations, ensure good airflow around the component, use a heat sink if necessary, and avoid overheating the component above 125°C.
The recommended soldering profile for the TPH2R104PL,LQ is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
To ensure the reliability of the TPH2R104PL,LQ in high-vibration environments, use a secure mounting method such as screwing or adhesive bonding, and ensure the component is properly secured to the PCB. Additionally, consider using a vibration-dampening material or a shock-absorbing mount.
The TPH2R104PL,LQ has an ESD sensitivity of 2kV human body model (HBM) and 200V machine model (MM). Handle the component with ESD-safe materials and follow proper ESD handling procedures to prevent damage.
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TPH2R104PL,LQ Overview
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