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TPSC226M016R0375 - Kyocera AVX

Description: Tantalum Capacitors 22uF 16V CASE-C_6032 RoHS

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TPSC226M016R0375 - Kyocera AVX - PCB symbol
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PCB Footprints
TPSC226M016R0375 - Kyocera AVX PCB footprint - Capacitor Moulded Polarised - Capacitor Moulded Polarised - CASE CODE C
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3D Models
TPSC226M016R0375 - Kyocera AVX - 3D model - Capacitor Moulded Polarised - CASE CODE C
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TPSC226M016R0375 Details

  • Manufacturer Part Number:

    TPSC226M016R0375

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Czechia, El Salvador

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Kyocera AVX Components

  • YTEOL:

    6.7

  • Additional Feature:

    ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ

  • Capacitance:

    22 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (DRY/SOLID)

  • ESR:

    375 mΩ

  • Height:

    2.6 mm

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.0035 mA

  • Length:

    6 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, PLASTIC, 7 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    16 V

  • Ripple Current:

    217 mA

  • Size Code:

    2312

  • Surface Mount:

    YES

  • Tan Delta:

    0.06

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    J BEND

  • Width:

    3.2 mm

TPSC226M016R0375 Frequently Asked Questions (FAQs)

  • The recommended land pattern for TPSC226M016R0375 can be found in the Kyocera AVX Components' recommended land pattern document, which is available on their website. The document provides detailed information on the recommended pad layout, solder mask, and solder paste requirements.
  • The TPSC226M016R0375 has a high power density, and proper thermal management is crucial to ensure reliable operation. It is recommended to use a thermal pad or a heat sink to dissipate heat, and to ensure good airflow around the component. The datasheet provides thermal resistance values that can be used to estimate the junction temperature.
  • The maximum operating temperature range for TPSC226M016R0375 is -55°C to +125°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range. It is recommended to operate the component within a temperature range of -40°C to +105°C for optimal performance.
  • The TPSC226M016R0375 is a surface-mount component, and its reliability in high-vibration environments depends on the quality of the solder joints and the PCB's mechanical design. It is recommended to follow Kyocera AVX Components' guidelines for vibration testing and to ensure that the component is properly secured to the PCB using a robust solder joint and a suitable PCB design.
  • The TPSC226M016R0375 is a moisture-sensitive component, and its reliability in humid environments depends on the quality of the packaging and the storage conditions. It is recommended to follow Kyocera AVX Components' guidelines for moisture sensitivity and to ensure that the component is stored in a dry, cool place. Additionally, the component should be soldered within the recommended time frame to prevent moisture absorption.

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TPSC226M016R0375 Overview

Use the download button to access the TPSC226M016R0375 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TPSC2, or try a keyword search, such as Tantalum Capacitors

About Kyocera AVX

Kyocera AVX is a global leader in the design, manufacture, and supply of electronic components, including capacitors, resistors, filters, connectors, and advanced ceramic products. The company was formed as a result of Kyocera Corporation's acquisition of AVX Corporation, combining Kyocera's expertise in ceramic technologies with AVX's strength in passive electronic components. This merger has allowed Kyocera AVX to offer a broad and diversified product portfolio, serving various industries.

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Part Image TBJC226M016LBSB0924 Kyocera AVX Components

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Part Image TBJC226M016JBLZ0824 Kyocera AVX Components

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