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TPSMB510A-A - LITTELFUSE

Description: Automotive, Surface Mount 600 W in DO-214AA, Uni-Directional

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PCB Footprints
TPSMB510A-A - LITTELFUSE PCB footprint - Other - Other - DO-214AA (SMB J-Bend)
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3D Models
TPSMB510A-A - LITTELFUSE  - 3D model - Other - DO-214AA (SMB J-Bend)
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TPSMB510A-A Details

  • Manufacturer Part Number:

    TPSMB510A-A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.96

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

  • Breakdown Voltage-Max:

    535 V

  • Breakdown Voltage-Min:

    485 V

  • Breakdown Voltage-Nom:

    510 V

  • Clamping Voltage-Max:

    698 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    265

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    434 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    434 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

TPSMB510A-A Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the TPSMB510A-A is a rectangular pad with a minimum size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm hole in the center for the device's thermal pad.
  • To ensure proper thermal management, it is recommended to provide a thermal path from the device's thermal pad to a copper plane on the PCB, and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K.
  • The maximum allowable voltage stress for the TPSMB510A-A is 1.5 times the rated voltage (510V) for a maximum of 100ms, and 1.2 times the rated voltage for a maximum of 1s.
  • Yes, the TPSMB510A-A can be used in a parallel configuration to increase the overall surge current rating, but it is recommended to ensure that the devices are properly matched and that the PCB layout is designed to minimize inductance and resistance.
  • The typical response time of the TPSMB510A-A to a surge event is less than 1ns, making it suitable for protecting sensitive electronics from fast-rising surge events.

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TPSMB510A-A Overview

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