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TPSMP30AHM3_A/H - Vishay

Description: ESD Suppressors / TVS Diodes H. Pwr Dsty DO-220AA AEC-Q101 Qualified

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TPSMP30AHM3_A/H - Vishay PCB footprint - Other - Other - SMP
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TPSMP30AHM3_A/H - Vishay  - 3D model - Other - SMP
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TPSMP30AHM3_A/H Details

  • Manufacturer Part Number:

    TPSMP30AHM3_A/H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMP, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Date Of Intro:

    2016-09-21

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.39

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

  • Breakdown Voltage-Max:

    31.5 V

  • Breakdown Voltage-Min:

    28.5 V

  • Breakdown Voltage-Nom:

    30 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    41.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    2.5 V

  • JEDEC-95 Code:

    DO-220AA

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    185 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    2.5 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    25.6 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    25.6 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

TPSMP30AHM3_A/H Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TPSMP30AHM3_A/H is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a solder mask clearance of 0.2 mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The thermal pad of the TPSMP30AHM3_A/H should be connected to a large copper area on the PCB to dissipate heat efficiently. A thermal via or a thermal pad with a diameter of at least 1 mm is recommended to connect the thermal pad to the copper area.
  • The maximum operating temperature of the TPSMP30AHM3_A/H is 150°C. However, the device can withstand a maximum junction temperature of 175°C for a short period of time.
  • Yes, the TPSMP30AHM3_A/H is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure that it meets the requirements of high-reliability applications.
  • To ensure the reliability of the TPSMP30AHM3_A/H in a high-temperature environment, it is recommended to derate the device's power dissipation according to the ambient temperature. The device should also be mounted on a heat sink or a thermal interface material to dissipate heat efficiently.

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TPSMP30AHM3_A/H Overview

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