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TS1854AIDT - STMicroelectronics

Description: 1.8 V input/output, rail-to-rail, low power operational amplifiers SO-14

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TS1854AIDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO14
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TS1854AIDT Details

  • Manufacturer Part Number:

    TS1854AIDT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, SO-14

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.055 µA

  • Bias Current-Max (IIB) @25C:

    0.063 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    14

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.1 V/us

  • Slew Rate-Nom:

    0.2 V/us

  • Supply Current-Max:

    0.22 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    600

  • Voltage Gain-Min:

    3160

  • Wideband:

    NO

  • Width:

    3.9 mm

TS1854AIDT Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, ensure proper thermal design, use a heat sink if necessary, and consider derating the device's power dissipation at high temperatures.
  • STMicroelectronics recommends using a low-ESR ceramic capacitor with a value between 1uF to 10uF, depending on the specific application requirements. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • The enable pin (EN) should be tied to a logic high during normal operation. During power-up, the EN pin should be held low until the input voltage (VIN) reaches the minimum operating voltage. During power-down, the EN pin should be held low to ensure a clean shutdown.
  • The maximum allowed voltage on the output pin (VOUT) during startup or fault conditions is 6V. Exceeding this voltage may damage the internal circuitry. Ensure that the output voltage is properly clamped or protected to prevent overvoltage conditions.

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TS1854AIDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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