TS1854AIPT footprint, schematic symbol and 3D model by STMicroelectronics

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Part Number TS1854AIPT
Manufacturer STMicroelectronics
Pin Count 14
Part Category Integrated Circuit
Package Category Small Outline Packages
Footprint Name Small Outline Packages - TSSOP-14 package_14
Released Date Apr 8, 2026
Last Modified Date Apr 8, 2026 10:32 AM UTC
Pinout / Pin List Click Here (Member Only)

TS1854AIPT Details

Manufacturer Part Number:
TS1854AIPT
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
TSSOP
Package Description:
ROHS COMPLIANT, TSSOP-14
Pin Count:
14
ECCN Code:
EAR99
HTS Code:
8542.33.00.01
Manufacturer:
STMicroelectronics
YTEOL:
0
Amplifier Type:
OPERATIONAL AMPLIFIER
Architecture:
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB):
0.055 µA
Bias Current-Max (IIB) @25C:
0.063 µA
Common-mode Reject Ratio-Min:
60 dB
Common-mode Reject Ratio-Nom:
90 dB
Frequency Compensation:
YES
Input Offset Voltage-Max:
1000 µV
JESD-30 Code:
R-PDSO-G14
Length:
5 mm
Low-Bias:
NO
Low-Offset:
NO
Micropower:
YES
Number of Functions:
14
Number of Terminals:
4
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSSOP
Package Equivalence Code:
TSSOP14,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Power:
NO
Programmable Power:
NO
Qualification Status:
Not Qualified
Seated Height-Max:
1.2 mm
Slew Rate-Min:
0.1 V/us
Slew Rate-Nom:
0.2 V/us
Supply Current-Max:
0.22 mA
Supply Voltage Limit-Max:
7 V
Supply Voltage-Nom (Vsup):
3 V
Surface Mount:
YES
Technology:
BIPOLAR
Temperature Grade:
AUTOMOTIVE
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Unity Gain BW-Nom:
600
Voltage Gain-Min:
3160
Wideband:
NO
Width:
4.4 mm

TS1854AIPT Frequently Asked Questions (FAQs)

STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device within the recommended temperature range.
While the TS1854AIPT has internal ESD protection, it's not designed to withstand repeated or high-energy ESD events. External ESD protection devices may be necessary to ensure robustness in harsh environments. Additionally, follow proper handling and assembly procedures to minimize the risk of ESD damage.
The TS1854AIPT is a commercial-grade device, and its use in high-reliability or safety-critical applications should be carefully evaluated. STMicroelectronics recommends using devices specifically designed for such applications, such as those with automotive or industrial qualifications. Consult with STMicroelectronics or a qualified engineer to determine the suitability of the TS1854AIPT for your specific application.
To troubleshoot issues with the TS1854AIPT, start by consulting the datasheet and application notes. Verify that the device is operated within the recommended conditions, and check for proper PCB layout, decoupling, and signal integrity. Use oscilloscopes or logic analyzers to debug signal issues, and consider using STMicroelectronics' evaluation boards or development tools to isolate problems.

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TS1854AIPT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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