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TS1874AIYDT - STMicroelectronics

Description: Operating range from VCC = 1.8 to 6 V ■ Rail-to-rail input and output ■ Extended Vicm (VCC- - 0.2 V to VCC+ + 0.2 V) ■ Low supply current (400 µA) ■ Gain bandwidth product (1.6 MHz) ■ High unity gain stability ■ ESD tolerance (2 kV) ■ Latch-up immunity ■ Available in – SOT23-5 micropackage – MiniSO-8, SO-8, SO-14 – TSSOP8, TSSOP14 package

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TS1874AIYDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-14
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TS1874AIYDT Details

  • Manufacturer Part Number:

    TS1874AIYDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    LEAD FREE, SOP-14

  • Pin Count:

    14

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7.8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.15 µA

  • Bias Current-Max (IIB) @25C:

    0.125 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.06 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    14

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.38 V/us

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    1700

  • Voltage Gain-Min:

    3162

  • Wideband:

    NO

  • Width:

    3.9 mm

TS1874AIYDT Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. Always operate the device within the recommended temperature range and avoid overheating.
  • Although the datasheet specifies the recommended operating conditions, it's essential to note that the maximum allowed voltage on the input pins is typically limited to the supply voltage (VCC) + 0.3V to prevent damage to the internal ESD protection diodes.
  • To prevent ESD damage, handle the TS1874AIYDT with an anti-static wrist strap or mat, and ensure that the PCB is properly grounded during assembly. Avoid touching the device pins or handling the device in environments with high electrostatic charges.
  • STMicroelectronics recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a reflow soldering process, and the soldering time should be minimized to prevent thermal damage.

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TS1874AIYDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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