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TS25P05G - Taiwan Semiconductor

Description: Bridge Rectifiers 25 Amp 600 Volt 300 Amp IFSM

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PCB Footprints
TS25P05G - Taiwan Semiconductor PCB footprint - Other - Other - TS25P05G-1
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TS25P05G - Taiwan Semiconductor  - 3D model - Other - TS25P05G-1
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TS25P05G Details

  • Manufacturer Part Number:

    TS25P05G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    6.85

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    350 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-61249-2-21; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

TS25P05G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the TS25P05G is -40°C to 125°C.
  • To ensure reliability, it's recommended to follow the recommended operating conditions, use a heat sink if necessary, and ensure good thermal design and layout.
  • The maximum current rating for the TS25P05G is 5A, but it's recommended to derate the current based on the ambient temperature and thermal design.
  • To protect the TS25P05G from ESD, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design.
  • The recommended PCB layout and thermal design for the TS25P05G involves using a thermal pad, thermal vias, and a heat sink if necessary, and following good thermal design practices.

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