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TS391SN2T1G - onsemi

Description: Wide Supply Range; Low Supply Current; Low Input Bias Current; Low Input Offset Voltage

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Symbol
TS391SN2T1G - onsemi - PCB symbol
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PCB Footprints
TS391SN2T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP−5 CASE 483 ISSUE N
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3D Models
TS391SN2T1G - onsemi - 3D model - SOT23 (5-Pin) - TSOP−5 CASE 483 ISSUE N
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TS391SN2T1G Details

  • Manufacturer Part Number:

    TS391SN2T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.65

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.4 µA

  • Bias Current-Max (IIB) @25C:

    0.25 µA

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-COLLECTOR

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    850 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.25 mA

  • Supply Voltage Limit-Max:

    36 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

TS391SN2T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the bottom layer.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum TJ. Monitor the device's thermal performance and adjust the system design as needed.
  • The TS391SN2T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD-protection diodes or resistors.
  • Yes, the TS391SN2T1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured using a process that ensures high reliability and low defect rates. However, additional testing and validation may be required for specific applications.
  • Start by reviewing the datasheet and application notes to ensure that the device is being used within its recommended operating conditions. Use a logic analyzer or oscilloscope to monitor the device's inputs and outputs. Check for proper power supply decoupling, signal integrity, and thermal management. If issues persist, contact onsemi's technical support for further assistance.

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TS391SN2T1G Overview

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TS391SN2T1G Alternates

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Part Image NCV391SN2T1G onsemi

Comparator, 1 Func, 9000uV Offset-Max, 850ns Response Time, BIPolar, PDSO5