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TS53YL203MR10 - Vishay

Description: Vishay TS53YL Series SMD Trimmer Resistor with Gull Wing Terminations, 20kΩ ±20% 1/4W ±100ppm/°C Top Adjust

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TS53YL203MR10 - Vishay PCB footprint - Other - Other - TS53YL203MR10-3
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TS53YL203MR10 - Vishay  - 3D model - Other - TS53YL203MR10-3
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TS53YL203MR10 Details

  • Manufacturer Part Number:

    TS53YL203MR10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Actuator Orientation:

    VERTICAL

  • Actuator Type:

    SCREW

  • Construction:

    Rectangular

  • Ganging Number:

    1

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    3

  • Number of Turns:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2.7 mm

  • Package Length:

    5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    5 mm

  • Packing Method:

    TR, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    CECC41000

  • Resistance:

    20000 Ω

  • Resistance Law:

    LINEAR

  • Resistor Type:

    TRIMMER

  • Rotational Angle:

    220 deg

  • Size Code:

    2020

  • Surface Mount:

    YES

  • Technology:

    CERMET

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    GULL WING

  • Tolerance:

    20%

  • Working Voltage:

    70.7 V

TS53YL203MR10 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TS53YL203MR10 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
  • The TS53YL203MR10 has a thermal resistance of 35°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or thermal interface material, and provide adequate airflow around the component.
  • The recommended soldering profile for the TS53YL203MR10 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. A reflow soldering process is recommended.
  • Yes, the TS53YL203MR10 is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality construction and rigorous testing.
  • After soldering, clean the TS53YL203MR10 with a mild solvent, such as isopropyl alcohol, to remove any flux residue. Ensure the component is dried thoroughly to prevent moisture-related issues.

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TS53YL203MR10 Overview

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