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TS883IST - STMicroelectronics

Description: Rail-to-rail 0.9 V open-drain output, nanopower comparators

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TS883IST - STMicroelectronics - PCB symbol
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TS883IST - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - MiniSO-8-1
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TS883IST - STMicroelectronics - 3D model - Small Outline Packages - MiniSO-8-1
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TS883IST Details

  • Manufacturer Part Number:

    TS883IST

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MINISOP-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Response Time-Nom:

    20000 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.00126 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3 mm

TS883IST Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The TS883IST has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink or thermal ground plane.
  • The TS883IST is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device should be derated for operation above 85°C to ensure reliability.
  • The TS883IST has a shutdown pin (SHDN) that can be used to reduce power consumption when the device is not in use. Additionally, the device has a low-power mode that can be enabled by setting the MODE pin to a logic low. Refer to the datasheet for specific configuration details.
  • The recommended input capacitor value for the TS883IST is 10uF to 22uF, with a voltage rating of at least 6.3V. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.

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TS883IST Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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