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TS912BIYDT - STMicroelectronics

Description: Rail-to-rail CMOS dual operational amplifier

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TS912BIYDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO 8_2022
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TS912BIYDT Details

  • Manufacturer Part Number:

    TS912BIYDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    LEAD FREE, MICRO, PLASTIC, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.27

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Bias Current-Max (IIB) @25C:

    0.00015 µA

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0002 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    1.4 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    800

  • Voltage Gain-Min:

    2000

  • Wideband:

    NO

  • Width:

    3.9 mm

TS912BIYDT Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the TS912BIYDT is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device can operate beyond this range, but with reduced performance and reliability.
  • To ensure proper biasing, follow the recommended voltage supply and biasing scheme outlined in the datasheet. Typically, this involves connecting VCC to a stable 5V supply, and VEE to a stable -5V supply. Additionally, ensure that the input and output pins are properly terminated and matched to the recommended impedance.
  • The TS912BIYDT supports data transfer rates up to 100 Mbps, making it suitable for high-speed applications. However, the actual data transfer rate may vary depending on the system design, signal quality, and other factors.
  • The TS912BIYDT has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent damage. Use anti-static wrist straps, mats, and packaging materials, and ensure that the device is handled in a static-free environment.
  • The TS912BIYDT is not specifically designed or qualified for radiation-hardened applications. If you need a radiation-hardened device, consider using a different component that meets the required radiation tolerance standards.

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TS912BIYDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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