TS934BIN - STMicroelectronics

TS934BIN Details

• Manufacturer Part Number:

  TS934BIN

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  DIP

• Package Description:

  PLASTIC, DIP-14

• Pin Count:

  14

• ECCN Code:

  EAR99

• HTS Code:

  8542.33.00.01

• Manufacturer:

  STMicroelectronics

• YTEOL:

  0

• Amplifier Type:

  OPERATIONAL AMPLIFIER

• Architecture:

  VOLTAGE-FEEDBACK

• Average Bias Current-Max (IIB):

  0.00015 µA

• Bias Current-Max (IIB) @25C:

  0.00015 µA

• Common-mode Reject Ratio-Min:

  55 dB

• Common-mode Reject Ratio-Nom:

  85 dB

• Frequency Compensation:

  YES

• Input Offset Voltage-Max:

  2000 µV

• JESD-30 Code:

  R-PDIP-T14

• JESD-609 Code:

  e3

• Length:

  20 mm

• Low-Bias:

  YES

• Low-Offset:

  NO

• Micropower:

  YES

• Number of Functions:

  14

• Number of Terminals:

  4

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  DIP

• Package Equivalence Code:

  DIP14,.3

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE

• Packing Method:

  TUBE

• Power:

  NO

• Programmable Power:

  NO

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  5.1 mm

• Slew Rate-Nom:

  0.05 V/us

• Supply Current-Max:

  0.132 mA

• Supply Voltage Limit-Max:

  12 V

• Supply Voltage-Nom (Vsup):

  3 V

• Surface Mount:

  NO

• Technology:

  BICMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  MATTE TIN

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  2.54 mm

• Terminal Position:

  DUAL

• Unity Gain BW-Nom:

  100

• Wideband:

  NO

• Width:

  7.62 mm