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TS934IDT - STMicroelectronics

Description: Output rail-to-rail micropower operational amplifiers

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TS934IDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-14_
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TS934IDT Details

  • Manufacturer Part Number:

    TS934IDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, SOP-14

  • Pin Count:

    14

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.22

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Bias Current-Max (IIB) @25C:

    0.00015 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    15000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    14

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    0.132 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    100

  • Wideband:

    NO

  • Width:

    3.9 mm

TS934IDT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The TS934IDT has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, the device should be placed in a well-ventilated area to prevent overheating.
  • The TS934IDT is rated for operation from -40°C to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C. Engineers should ensure that the device is operated within the recommended temperature range to prevent damage or malfunction.
  • The TS934IDT can be programmed using the I2C interface. STMicroelectronics provides a programming guide and software tools, such as the STM32CubeMX, to simplify the programming process. Engineers can also use third-party programming tools and software.
  • The power consumption of the TS934IDT depends on the operating mode and frequency. In active mode, the typical current consumption is around 1.5 mA, while in standby mode, it is around 1 μA. Engineers should consult the datasheet for more detailed power consumption information.

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TS934IDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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