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TSB622IST - STMicroelectronics

Description: Low power, 1.7 MHz, rail-to-rail output, 36 V operational amplifier

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TSB622IST - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - MSOP8_2020
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TSB622IST - STMicroelectronics  - 3D model - Small Outline Packages - MSOP8_2020
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TSB622IST Details

  • Manufacturer Part Number:

    TSB622IST

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.045 µA

  • Bias Current-Max (IIB) @25C:

    0.03 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1600 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    0.2 V/us

  • Slew Rate-Nom:

    0.58 V/us

  • Supply Current-Max:

    0.84 mA

  • Supply Voltage Limit-Max:

    40 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1550

  • Voltage Gain-Min:

    79432.82347

  • Wideband:

    NO

  • Width:

    3 mm

TSB622IST Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The TSB622IST has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the device and avoid blocking the thermal pad with components or soldermask.
  • The TSB622IST is rated for operation from -40°C to 125°C (junction temperature). However, the device can be operated up to 150°C with derating. Consult the datasheet for specific derating curves and guidelines.
  • Follow proper PCB design and layout practices, such as using a solid ground plane, minimizing loop areas, and using shielding or filtering components as needed. Additionally, ensure that the device is properly decoupled and that the power supply is well-regulated to minimize electromagnetic emissions.
  • STMicroelectronics recommends using X7R or X5R ceramic capacitors with a minimum capacitance of 10 μF for the input and output capacitors. The capacitor values may need to be adjusted based on the specific application and operating conditions.

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TSB622IST Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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