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TSB622IYDT - STMicroelectronics

Description: Low power, 1.7 MHz, rail-to-rail output, 36 V operational amplifier

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TSB622IYDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO 8_1
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TSB622IYDT - STMicroelectronics  - 3D model - Small Outline Packages - SO 8_1
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TSB622IYDT Details

  • Manufacturer Part Number:

    TSB622IYDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.045 µA

  • Bias Current-Max (IIB) @25C:

    0.03 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1600 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.2 V/us

  • Slew Rate-Nom:

    0.58 V/us

  • Supply Current-Max:

    0.84 mA

  • Supply Voltage Limit-Max:

    40 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1550

  • Voltage Gain-Min:

    79432.82347

  • Wideband:

    NO

  • Width:

    3.9 mm

TSB622IYDT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4571, which includes guidelines for thermal pad connection, copper pour, and via placement to ensure optimal thermal performance.
  • The input capacitor selection depends on the input voltage, output voltage, and output current. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the input voltage, and a capacitance value between 1uF to 10uF. Refer to the application note AN4571 for more detailed guidance.
  • The enable pin (EN) has a maximum allowed voltage of 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure the EN pin voltage does not exceed 6V to prevent damage to the device.
  • The TSB622IYDT has a junction temperature (Tj) rating of 150°C, but the device's performance and reliability may degrade at high temperatures. It's recommended to operate the device within the specified temperature range (–40°C to 125°C) for optimal performance and reliability.
  • To ensure proper power-up and power-down, follow the recommended power-up and power-down sequences outlined in the datasheet. Additionally, ensure the input voltage is stable and within the recommended range before enabling the device.

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TSB622IYDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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