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TSC102IDT - STMicroelectronics

Description: High-side current sense amplifier plus signal conditioning amplifier

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TSC102IDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO 8_2022
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TSC102IDT Details

  • Manufacturer Part Number:

    TSC102IDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, PLASTIC, TSSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    0.7 mA

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TSC102IDT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4171, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The thermal shutdown feature is activated when the junction temperature exceeds 150°C. To handle this, ensure proper thermal design and heat sinking, and consider implementing a thermal monitoring and shutdown circuit to prevent damage to the device.
  • The TSC102IDT can drive capacitive loads up to 1000 pF, but it's recommended to limit the load to 100 pF or less to ensure stable operation and prevent oscillations.
  • To configure the TSC102IDT for bidirectional communication, connect the DIR pin to a digital output that controls the direction of data transfer, and use the EN pin to enable or disable the transceiver. Refer to the datasheet and application notes for specific configuration details.
  • STMicroelectronics recommends using a TVS (Transient Voltage Suppressor) diode or a dedicated ESD protection device, such as the ST's ESDAxx series, to protect the TSC102IDT from electrostatic discharge.

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TSC102IDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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