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TSM104WAIDT - STMicroelectronics

Description: QUAD OPERATIONAL AMPLIFIER AND PROGRAMMABLE VOLTAGE REFERENCE

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TSM104WAIDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - 16 PINS - PLASTIC MICROPACKAGE (SO)-1
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TSM104WAIDT - STMicroelectronics  - 3D model - Small Outline Packages - 16 PINS - PLASTIC MICROPACKAGE (SO)-1
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TSM104WAIDT Details

  • Manufacturer Part Number:

    TSM104WAIDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    MICRO, PLASTIC, SO-16

  • Pin Count:

    16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.27

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.2 µA

  • Bias Current-Max (IIB) @25C:

    0.15 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    16

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.1 V/us

  • Slew Rate-Nom:

    0.3 V/us

  • Supply Current-Max:

    4 mA

  • Supply Voltage Limit-Max:

    36 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    900

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    3.9 mm

TSM104WAIDT Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet, and to ensure good thermal conduction to the PCB and heat sink.
  • STMicroelectronics recommends using a low-ESR ceramic capacitor with a value of 10-22uF, depending on the specific application requirements, to ensure optimal performance and stability.
  • To troubleshoot oscillations or instability issues, check the PCB layout for proper decoupling, ensure that the input and output capacitors are properly sized and placed, and verify that the device is operated within its recommended operating conditions.
  • STMicroelectronics recommends using a low-ESR ceramic capacitor with a value of 10-47uF, depending on the specific application requirements, to ensure optimal performance and stability.

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TSM104WAIDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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