TSOP36238TR footprint, schematic symbol and 3D model by Vishay

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TSOP36238TR Details

A recommended PCB layout for the TSOP36238TR would be to keep the component away from high-frequency noise sources, use a solid ground plane, and minimize the length of the signal traces to reduce noise and signal degradation.
To ensure reliability in high-temperature applications, it is recommended to follow the recommended operating temperature range, use a heat sink if necessary, and ensure good thermal conductivity between the component and the PCB.
The recommended soldering profile for the TSOP36238TR is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It is also recommended to use a solder with a melting point above 217°C.
To handle the TSOP36238TR for optimal ESD protection, it is recommended to use an ESD wrist strap or mat, handle the component by the body or leads, and avoid touching the component pins or die.
The recommended storage and handling procedure for the TSOP36238TR is to store the component in its original packaging, away from direct sunlight and moisture, and handle the component in a clean and dry environment.

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