TSSF4500 footprint, schematic symbol and 3D model by Vishay

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TSSF4500 Details

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Use a soldering temperature of 260°C (500°F) for 10 seconds or less. Avoid using excessive soldering temperatures or times to prevent damage to the device.
The maximum allowed voltage on the sense pins is 5.5V. Exceeding this voltage may damage the device.
Yes, the TSSF4500 is suitable for high-frequency applications up to 100 kHz. However, the device's performance may degrade at higher frequencies due to internal capacitance and inductance.
Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the TSSF4500 from electrostatic discharge.

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Use the download button to access the TSSF4500 schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like TSSF4, or try a keyword search, such as Infrared LEDs

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Image	Part Number	Model
	TSSF4500 Telefunken Microelectronics Gmbh Infrared LED, 870nm
	TSSF4500 Temic Semiconductors Infrared LED, 3.5mm, 1-Element, 870nm
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