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TSV622AIDT - STMicroelectronics

Description: Rail-to-rail input/output 5V CMOS Op-Amps, micro-power (29uA), GBP=420kHz, small offset, dual

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TSV622AIDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO 8_2022
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TSV622AIDT Details

  • Manufacturer Part Number:

    TSV622AIDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2200 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.1 V/us

  • Slew Rate-Nom:

    0.19 V/us

  • Supply Current-Max:

    0.076 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    420

  • Voltage Gain-Min:

    4470

  • Wideband:

    NO

  • Width:

    3.9 mm

TSV622AIDT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TSV622AIDT is 320mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (RthJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, such as minimizing parasitic capacitance and inductance, and using a low-ESR capacitor for decoupling. Additionally, the gain resistors should be chosen to minimize phase shift and ensure a stable phase margin.
  • The recommended operating voltage range for the TSV622AIDT is 1.5V to 5.5V, although the device can operate down to 1.2V with reduced performance. It's essential to ensure the voltage supply is within the recommended range to maintain optimal performance and prevent damage to the device.
  • The TSV622AIDT has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and wrist straps to prevent damage from static electricity.
  • The maximum input voltage range for the TSV622AIDT is from -0.5V to VCC + 0.5V. Exceeding this range can cause damage to the device or affect its performance.

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TSV622AIDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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