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TT8J11TCR - ROHM Semiconductor

Description: ROHM TT8J11TCR Dual P-channel MOSFET, 3.5 A, 12 V TT8J11, 8-Pin TSST

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TT8J11TCR - ROHM Semiconductor PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - TT8J11TCR_11
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3D Models
TT8J11TCR - ROHM Semiconductor  - 3D model - SO Transistor Flat Lead - TT8J11TCR_11
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TT8J11TCR Details

  • Manufacturer Part Number:

    TT8J11TCR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSST8, 8 PIN

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    3.5 A

  • Drain-source On Resistance-Max:

    0.043 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.25 W

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

TT8J11TCR Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the TT8J11TCR is 1.65V to 5.5V, as specified in the datasheet.
  • To ensure proper power-on and power-off, follow the power-up and power-down sequences outlined in the datasheet, and make sure to meet the recommended power supply ramp-up and ramp-down times.
  • The maximum current rating for the TT8J11TCR is 100mA, as specified in the datasheet. Exceeding this rating may cause damage to the device.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and follow the thermal design guidelines outlined in the datasheet.
  • Follow the recommended PCB layout guidelines outlined in the datasheet, including keeping the device away from noise sources, using a solid ground plane, and minimizing trace lengths and widths.

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