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TTC014,L1NV - Toshiba

Description: Trans GP BJT NPN 800V 1A 1000mW Automotive 3-Pin

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TTC014,L1NV - Toshiba PCB footprint - Other - Other - New PW-MOLD
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TTC014,L1NV - Toshiba  - 3D model - Other - New PW-MOLD
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TTC014,L1NV Details

  • Manufacturer Part Number:

    TTC014,L1NV

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    1 A

  • Collector-Base Capacitance-Max:

    26 pF

  • Collector-Emitter Voltage-Max:

    800 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PSSO-G2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    1 W

  • Power Dissipation-Max (Abs):

    40 W

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • VCEsat-Max:

    1 V

TTC014,L1NV Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • To ensure reliability, follow the recommended operating temperature range, use a heat sink if necessary, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • The maximum allowable voltage for the TTC014 is 1.5V, exceeding which may cause damage to the device.
  • Yes, the TTC014 is suitable for high-frequency applications up to 1.4 GHz, but ensure to follow the recommended layout and decoupling guidelines to minimize parasitic effects.
  • The TTC014 requires a specific power sequencing order to prevent damage; ensure to power up the VCC pin before the VIN pin, and power down the VIN pin before the VCC pin.

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