TUHS25F05 - Cosel

TUHS25F05 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Cosel recommends a PCB layout with a large copper area for heat dissipation, and a minimum of 2oz copper thickness. A thermal via array under the module can also improve heat transfer.
• How do I ensure reliable start-up and shutdown of the TUHS25F05?
  To ensure reliable start-up and shutdown, Cosel recommends a soft-start circuit to limit inrush current, and a shutdown circuit with a minimum of 10ms delay to prevent voltage spikes.
• What are the derating curves for the TUHS25F05 at high temperatures?
  Cosel provides derating curves in the datasheet, but for specific high-temperature applications, engineers can contact Cosel's technical support for customized derating curves based on their specific use case.
• Can I use the TUHS25F05 in a redundant or N+1 configuration?
  Yes, the TUHS25F05 can be used in redundant or N+1 configurations. However, Cosel recommends consulting with their technical support team to ensure proper implementation and to discuss specific requirements.
• What are the EMI filter requirements for the TUHS25F05?
  Cosel recommends using a CISPR 11 Class B or Class A EMI filter, depending on the application's EMI requirements. The filter should be designed to attenuate noise in the 150kHz to 30MHz frequency range.