The recommended PCB layout for optimal thermal performance is to have a large copper area on the bottom layer of the PCB, connected to the thermal pad of the TV02W130B-G. This helps to dissipate heat efficiently. Additionally, it's recommended to have vias under the thermal pad to connect it to the copper area.
To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the TV02W130B-G. Additionally, ensure good thermal design, including a heat sink if necessary, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
The recommended soldering profile for the TV02W130B-G is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
The TV02W130B-G is not designed for use in high-humidity environments. It's recommended to use a conformal coating or potting compound to protect the device from moisture. Additionally, ensure that the PCB is designed with moisture-resistant materials and follows good design practices for humid environments.
The recommended storage condition for the TV02W130B-G is in a dry, cool place, away from direct sunlight. The storage temperature should be between -40°C and 30°C, and the humidity should be below 60%. It's also recommended to store the devices in their original packaging or in a sealed bag with desiccant.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
TV02W130B-G Overview
Use the download button to access the TV02W130B-G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TV02W,
or try a keyword search, such as Transient Suppressors
