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TYN1012TRG - STMicroelectronics

Description: Standard 12 A SCRs

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TYN1012TRG - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB-9
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3D Models
TYN1012TRG - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-220AB-9
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TYN1012TRG Details

  • Manufacturer Part Number:

    TYN1012TRG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.43

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    40 V/us

  • DC Gate Trigger Current-Max:

    0.2 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    15 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Non-Repetitive Pk On-state Cur:

    146 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    8000 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    12 A

  • Repetitive Peak Off-state Voltage:

    1000 V

  • Repetitive Peak Reverse Voltage:

    1000 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    SCR

TYN1012TRG Frequently Asked Questions (FAQs)

  • A good thermal design should be used to ensure the device operates within the recommended temperature range. A 2-layer or 4-layer PCB with a solid ground plane and thermal vias can help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and heat sink.
  • Monitor the device's temperature, input voltage, output voltage, and output current to detect potential faults. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage to the device and ensure safe operation.
  • To optimize the device's performance for low-power applications, consider using a low-dropout regulator (LDO) or a switching regulator with a low quiescent current. Additionally, optimize the PCB layout to minimize power losses and use low-power modes when possible.
  • Use a combination of EMI filters, such as ferrite beads and capacitors, to reduce electromagnetic interference. Implement proper shielding techniques, such as using a metal can or a shielded enclosure, to minimize electromagnetic radiation.

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TYN1012TRG Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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