Laird recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1W/m-K or higher is suggested for optimal heat transfer.
Laird recommends following the recommended soldering profile and using a solder with a melting point of 217°C or higher. The module should be handled with care to avoid mechanical stress and damage to the components. A clean and dry assembly environment is also essential.
The TYS40306R8M-10 module is rated for operation from -40°C to +85°C. However, the optimal operating temperature range for maximum performance and reliability is between 0°C to +70°C.
The module is not designed for use in humid or high-moisture environments. Laird recommends using the module in a dry environment with a relative humidity of 60% or less. If the module is exposed to high humidity, it may be necessary to use additional protection measures such as conformal coating or hermetic sealing.
The typical lead time for the TYS40306R8M-10 module is 6-8 weeks, and the minimum order quantity (MOQ) is 500 pieces. However, these values may vary depending on the region, distributor, and availability. It's recommended to check with Laird or an authorized distributor for the most up-to-date information.
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TYS40306R8M-10 Overview
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