Laird PLC recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1 W/m-K or higher is suggested to improve heat transfer between the device and the heat sink.
To ensure reliable operation in high-vibration environments, Laird PLC recommends securing the device using a screw or adhesive that can withstand the expected vibration levels. Additionally, the device should be mounted on a PCB with a rigid and stable design to minimize flexure and stress on the component.
While the datasheet specifies an operating temperature range of -40°C to 85°C, Laird PLC recommends derating the device's power output by 1.5% per degree Celsius above 70°C to ensure reliable operation and prevent overheating.
Laird PLC recommends using a conformal coating or potting compound to protect the device from moisture and humidity. Additionally, the device should be stored in a dry, clean environment with a relative humidity below 60% to prevent moisture absorption.
Laird PLC recommends a soldering profile with a peak temperature of 240°C ± 5°C, a dwell time above 217°C of 20-30 seconds, and a total process time of 60-90 seconds. A nitrogen atmosphere is recommended to minimize oxidation and ensure reliable solder joints.
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TYS60453R3N-10 Overview
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