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TZMC16-GS08 - Vishay

Description: Zener Diodes 16 Volt 0.5 Watt

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PCB Footprints
TZMC16-GS08 - Vishay PCB footprint - Other - Other - TZMC13-GS08-2
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TZMC16-GS08 Details

  • Manufacturer Part Number:

    TZMC16-GS08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    LOW NOISE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    40 Ω

  • JESD-30 Code:

    O-LELF-R2

  • JESD-609 Code:

    e2

  • Knee Impedance-Max:

    170 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    16 V

  • Reverse Current-Max:

    2 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin/Silver (Sn97.5Ag2.5)

  • Terminal Form:

    WRAP AROUND

  • Terminal Position:

    END

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Temp Coeff-Max:

    17.6 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

TZMC16-GS08 Frequently Asked Questions (FAQs)

  • The recommended storage condition for TZMC16-GS08 is in a dry, cool place, away from direct sunlight, and in its original packaging or anti-static bag to prevent moisture absorption and electrostatic discharge.
  • While the TZMC16-GS08 is suitable for high-frequency applications, its performance may degrade above 1 GHz due to parasitic inductance and capacitance. It's essential to evaluate the component's behavior in your specific application and consider using a high-frequency model or simulation tools to ensure optimal performance.
  • To ensure reliable operation, it's crucial to consider the TZMC16-GS08's thermal characteristics. Make sure to provide adequate heat sinking, follow recommended PCB layout guidelines, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • Yes, to prevent damage, follow the recommended soldering profile: peak temperature of 260°C, soldering time of 10 seconds, and a maximum of 3 reflows. Use a solder with a melting point above 217°C, and avoid using solder with a high silver content.
  • While the TZMC16-GS08 has a moisture sensitivity level (MSL) of 1, it's still essential to take precautions in humid or high-moisture environments. Consider using a conformal coating, potting, or hermetic sealing to protect the component from moisture ingress.

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TZMC16-GS08 Overview

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