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TZMC1V0-GS18 - Vishay

Description: Zener Diodes ZENER DIODE SOD80 MINIMELF-e2

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Symbol
TZMC1V0-GS18 - Vishay - PCB symbol
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PCB Footprints
TZMC1V0-GS18 - Vishay PCB footprint - Other - Other - MiniMELF Glass Case (SOD-80)
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3D Models
TZMC1V0-GS18 - Vishay - 3D model - Other - MiniMELF Glass Case (SOD-80)
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TZMC1V0-GS18 Details

  • Manufacturer Part Number:

    TZMC1V0-GS18

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GLASS, MINIMELF-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    O-LELF-R2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    WRAP AROUND

  • Terminal Position:

    END

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    6.7%

  • Working Test Current:

    5 mA

TZMC1V0-GS18 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TZMC1V0-GS18 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for Vishay SMD Devices' (document number 28356).
  • To prevent damage during soldering, it's recommended to follow the guidelines in the JEDEC standard J-STD-020D.1, which provides guidelines for the soldering of electronic components. Additionally, the component should be soldered within the recommended temperature range of 260°C for 10 seconds or less.
  • The MSL of the TZMC1V0-GS18 is MSL 1, which means it can be exposed to a maximum of 30°C/85% relative humidity for 168 hours without being sensitive to moisture.
  • Yes, the TZMC1V0-GS18 is suitable for high-reliability applications due to its construction and testing, which meet the requirements of AEC-Q101 and IEC 61071 standards.
  • The ESR of the TZMC1V0-GS18 is not explicitly stated in the datasheet, but it can be estimated to be around 1-2 ohms based on the component's internal construction and similar products from Vishay Intertechnologies.

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TZMC1V0-GS18 Overview

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