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UBA2021T/N2,518 - NXP

Description: CFL/TL Controller Controller 41.21kHz ~ 44.59kHz No 14-SO

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UBA2021T/N2,518 - NXP - PCB symbol
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PCB Footprints
UBA2021T/N2,518 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT108-1
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3D Models
UBA2021T/N2,518 - NXP - 3D model - Small Outline Packages - SOT108-1
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UBA2021T/N2,518 Details

  • Manufacturer Part Number:

    UBA2021T/N2,518

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, PLASTIC, SOT-108-1, SO-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    SOT108-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    6.5 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    5.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

UBA2021T/N2,518 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
  • Monitor the device's junction temperature, ensure the input voltage is within the recommended range, and avoid exceeding the maximum current ratings. Also, use a suitable heat sink to prevent overheating.
  • Use a common mode choke, add a ferrite bead or a pi-filter to the input, and ensure the PCB layout is optimized for EMI reduction. Also, consider adding a shield or a metal can to the device.
  • Check the PCB layout, ensure proper decoupling, and verify the input voltage and current ratings. Use an oscilloscope to analyze the output waveform and check for signs of oscillation or instability.
  • Use a heat sink with a thermal resistance of <1°C/W, ensure good airflow, and avoid blocking the airflow around the device. Also, consider using a thermal interface material to improve heat transfer.

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UBA2021T/N2,518 Overview

Use the download button to access the UBA2021T/N2,518 schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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