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UCLAMP0571P.TNT - SEMTECH

Description: ESD Suppressors / TVS Diodes 5V, 1-Line Surge protection SGP1610N2

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PCB Footprints
UCLAMP0571P.TNT - SEMTECH PCB footprint - Diodes Chip - Diodes Chip - spg1610
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3D Models
UCLAMP0571P.TNT - SEMTECH  - 3D model - Diodes Chip - spg1610
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UCLAMP0571P.TNT Details

  • Manufacturer Part Number:

    UCLAMP0571P.TNT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Semtech Corporation

  • YTEOL:

    6.36

  • Breakdown Voltage-Max:

    9 V

  • Breakdown Voltage-Min:

    6 V

  • Breakdown Voltage-Nom:

    7 V

  • Clamping Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-XBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

UCLAMP0571P.TNT Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern for UCLAMP0571P.TNT can be found in the Semtech Corporation's application note AN12033. It provides guidelines for optimal PCB design, component placement, and thermal management.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended thermal management guidelines, including proper heat sinking, thermal interface material selection, and PCB design. Additionally, ensure that the device is operated within the specified temperature range and that the junction temperature does not exceed the maximum rating.
  • The UCLAMP0571P.TNT has built-in ESD protection, but it is still essential to follow proper handling and storage precautions to prevent damage. Handle the device by the body, avoid touching the pins, and store it in an anti-static package or bag. Follow the recommended handling and storage guidelines outlined in the datasheet and industry standards.
  • The UCLAMP0571P.TNT is a commercial-grade device, and its use in high-reliability or aerospace applications may require additional testing, validation, and certification. Engineers should consult with Semtech Corporation's sales team or application engineers to discuss specific requirements and potential customization options.
  • The UCLAMP0571P.TNT is not specifically designed or tested for radiation hardness or latch-up immunity. If these features are required, engineers should consider alternative devices or consult with Semtech Corporation's application engineers to discuss potential customization options.

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