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UCR18EVHFSR012 - ROHM Semiconductor

Description: 3216(1206)Size, Thick Film Low Ohmic Chip Resistors For Current Detection (AEC-Q200 Qualified)

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PCB Footprints
UCR18EVHFSR012 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - UCR18-1
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UCR18EVHFSR012 - ROHM Semiconductor  - 3D model - Resistor Chip - UCR18-1
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UCR18EVHFSR012 Details

  • Manufacturer Part Number:

    UCR18EVHFSR012

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    11

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.012 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    0,350 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

UCR18EVHFSR012 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. ROHM also recommends using a thermistor or thermocouple to monitor the temperature and adjust the operating conditions accordingly.
  • ROHM recommends using X7R or X5R ceramic capacitors with a voltage rating of 50V or higher for the input and output capacitors. The recommended capacitance values are 10uF to 22uF for the input capacitor and 10uF to 47uF for the output capacitor. The capacitor's ESR should be less than 100mΩ to ensure stable operation.
  • To prevent EOS and ESD damage, follow proper handling and storage procedures for the device. Use an anti-static wrist strap or mat when handling the device, and ensure that the PCB is properly grounded. Implement ESD protection circuits, such as TVS diodes or ESD arrays, on the input and output lines to protect the device from voltage transients.
  • ROHM recommends a soft-start sequence to prevent inrush currents and ensure reliable operation. The recommended sequence is to apply the input voltage first, followed by the enable signal. The enable signal should be applied after the input voltage has reached its nominal value.

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UCR18EVHFSR012 Overview

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