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UDZSTE-1716B - ROHM Semiconductor

Description: Zener Diodes 16V 5MA

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PCB Footprints
UDZSTE-1716B - ROHM Semiconductor PCB footprint - Other - Other - UMD2_SOD-323F
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3D Models
UDZSTE-1716B - ROHM Semiconductor  - 3D model - Other - UMD2_SOD-323F
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UDZSTE-1716B Details

  • Manufacturer Part Number:

    UDZSTE-1716B

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-76

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    50 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e1

  • Knee Impedance-Max:

    80 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    16 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    2.04%

  • Working Test Current:

    5 mA

UDZSTE-1716B Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation.
  • Implement a heat sink or thermal pad, and ensure good airflow around the device. Also, consider derating the device's power dissipation according to the ambient temperature.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, placed as close to the VIN pin as possible, to minimize noise and ensure stable operation.
  • Use an anti-static wrist strap or mat, and handle the device by the body or pins, avoiding direct contact with the die. Ensure the PCB is properly grounded during assembly.
  • A 10uF to 47uF X7R or X5R ceramic capacitor is recommended, placed as close to the VOUT pin as possible, to minimize output ripple and ensure stable operation.

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UDZSTE-1716B Overview

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Part Image UDZVTE-1716B ROHM Semiconductor

Zener Diode, 16V V(Z), 2.04%, 0.2W, Silicon, Unidirectional

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Zener Diode, 15V V(Z), 2.18%, 0.2W, Silicon, Unidirectional