UDZSTE-175.6B footprint, schematic symbol and 3D model by ROHM Semiconductor

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UDZSTE-175.6B Details

A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the tab of the UDZSTE-175.6B, and to use thermal vias to dissipate heat to the bottom layer of the PCB.
To ensure reliable soldering, use a soldering iron with a temperature range of 250-270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the component.
The maximum allowed voltage transient for the UDZSTE-175.6B is 1.5 times the maximum rated voltage, but it's recommended to consult with ROHM Semiconductor's application engineers for specific guidance on voltage transient tolerance.
While the UDZSTE-175.6B is designed to operate in a variety of environments, it's recommended to take precautions when using it in high-humidity environments. Consider applying a conformal coating and ensuring the PCB is designed with moisture-resistant materials.
Store the UDZSTE-175.6B in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -10°C to 30°C, and the recommended humidity range is 20% to 80% RH.

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Use the download button to access the UDZSTE-175.6B schematic symbol, PCB footprint, and 3D model.

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