UDZSTE-179.1B footprint, schematic symbol and 3D model by ROHM Semiconductor

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UDZSTE-179.1B Details

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Ensure proper heat sinking, avoid overheating, and follow the recommended operating temperature range (-40°C to 150°C). Also, consider derating the device's power rating at higher temperatures.
Handle the device by the body, avoid touching the pins, and store it in a dry, cool place. Avoid exposure to moisture, direct sunlight, and extreme temperatures.
Yes, but ensure you follow the recommended qualification process, and consult with ROHM Semiconductor for specific requirements and documentation.
Consult the datasheet and application notes, and perform a thorough analysis of the circuit design, PCB layout, and component selection. Consider seeking support from ROHM Semiconductor or a qualified engineer.

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Use the download button to access the UDZSTE-179.1B schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like UDZST, or try a keyword search, such as Zener Diodes

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