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UDZUVFHTE-175.6B - ROHM Semiconductor

Description: 3.3V, UMD2, Automotive Transient Voltage Suppressor (AEC-Q101 Qualified)

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UDZUVFHTE-175.6B - ROHM Semiconductor PCB footprint - Other - Other - UMD2_2024-9
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UDZUVFHTE-175.6B - ROHM Semiconductor  - 3D model - Other - UMD2_2024-9
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UDZUVFHTE-175.6B Details

  • Manufacturer Part Number:

    UDZUVFHTE-175.6B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-90A, SOD-323FL, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    5.73 V

  • Breakdown Voltage-Min:

    5.49 V

  • Breakdown Voltage-Nom:

    5.61 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q100; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

UDZUVFHTE-175.6B Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for UDZUVFHTE-175.6B is -20°C to 70°C, but it can vary depending on the specific application and environmental conditions.
  • To ensure reliability in high-temperature applications, it's essential to consider factors such as thermal design, heat sink design, and component derating. ROHM Semiconductor provides guidelines for high-temperature applications in their application notes and technical documentation.
  • ROHM Semiconductor recommends using a soldering temperature range of 280°C to 310°C, with a maximum soldering time of 10 seconds. They also recommend using a solder with a melting point above 300°C to prevent overheating and damage to the component.
  • To prevent damage during assembly and installation, handle the component by the edges, avoid applying excessive force or pressure, and use anti-static equipment and materials to prevent electrostatic discharge (ESD) damage.
  • ROHM Semiconductor recommends storing the component in a dry, cool environment, away from direct sunlight and moisture. The component should be stored in its original packaging or a similar protective package to prevent damage during storage and transportation.

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UDZUVFHTE-175.6B Overview

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